Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films
US7629031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jan 3, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/515
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Plasma Enhanced Bonding (PEB) during a coating process is used to improve both adhesion and corrosion resistance of the resulting coating. New interfacial compounds may be formed, offering the increased resistance to corrosion, as well as enhanced bonding to the workpiece being coated and any subsequently formed layer, such as diamond-like carbon. In one embodiment, the PEB processing is employed during coating of at least one interior surface of the workpiece, which may be a pipe. In a first step, a thin film is deposited. Then, the film is exposed to a high energy etch-back plasma. This two-step cycle of depositing a film and then providing bombardment of the film may be repeated a number of times. Typically, the deposition step of the cycle is much shorter than the bombardment step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.