Patterning metal layers
US7629261B2 · kind B2 · utility
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2References
12Claims
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Key dates
| Filing date | Apr 4, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/1135
Abstract
A process for fabricating an electronic device comprising the step of patterning a metallic electrode to the electronic device by laser ablation followed by electroless plating, wherein the process of fabricating the electronic device comprises at least one other laser patterning step over the area of the metallic electrode performed after said step of patterning the metallic electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.