Wired circuit board
US7629539B2 · kind B2 · utility
26Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jun 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09554
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.