Semiconductor package, memory card including the same, and mold for fabricating the memory card
US7629679B2 · kind B2 · utility
12Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.