Surface acoustic wave device and fabrication method thereof
US7629729B2 · kind B2 · utility
11Cited by
4References
9Claims
0Family size
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Key dates
| Filing date | Oct 3, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jul 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.