Method for manufacturing surface acoustic wave device and surface acoustic wave device
US7629866B2 · kind B2 · utility
5Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2008 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jul 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of the piezoelectric substrate from the one principal surface of the piezoelectric substrate, thereby forming a recessed portion including the bottom surface in which the IDT electrodes are embedded, and a step of bonding a cover member to the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.