Optical interconnection module
US7630594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4231
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical interconnection module includes at least one optoelectronic element, at least one substrate, and at least one optical coupling element. A plurality of matching elements is formed on one side of the optical coupling element opposite to the optoelectronic element and the substrate. A plurality of alignment elements is formed in the optoelectronic element and the substrate at positions corresponding to the matching elements. The matching elements and alignment elements are engaged with each other for alignment, such that the optoelectronic element, the substrate and the optical coupling element are directly aligned during assembly. Moreover, the optical coupling element is used to increase the optical coupling efficiency of the optoelectronic element and an optical waveguide formed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.