Method and process for embedding electrically conductive elements in a dielectric layer
US7631423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2006 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Apr 28, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded electrically conductive elements. An electrically conductive undercoat may be applied over the surface of the conductive layer and a second circuit pattern is formed over the electrically conductive undercoat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.