Patent · US Active

Method for enhancing the solderability of a surface

US7631798B1 · kind B1 · utility

0Cited by

15References

9Claims

0Family size

Inventors

Ernest Long · Burlington, US
Lenora M. Toscano · Bristol, US
Paul Romaine · Oakville, US
Colleen Mckirryher · Thomaston, US
Donna M. Kologe · Thomaston, US
Steven A. Castaldi · Torrington, US
Carl Steinecker · South Lyon, US

Key dates

Filing date	Oct 2, 2008
Grant date	Dec 15, 2009
Priority date	—
Expiry date	Oct 2, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/244
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.