High density circular interconnect with bayonet action
US7632126B1 · kind B1 · utility
9Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2008 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | May 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high density electrical interconnect is disclosed that uses a bayonet action to mate a plug having a plurality of contacts to receptacle having a plurality of spring contacts. The plurality of contacts may be a plurality of pin contacts, printed circuit board traces, or flexible film contacts. The spring contacts are preloaded to reduce the insertion force required to mate the plug and receptacle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.