Electroless palladium plating solution
US7632343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2008 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.