Resin composition for composite dielectric material, composite dielectric material and electric circuit board using the same
US7632884B2 · kind B2 · utility
0Cited by
12References
12Claims
0Family size
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Key dates
| Filing date | Sep 28, 2004 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Nov 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to provide a liquid composition for an organic-inorganic composite dielectric excellent in dispersibility of an inorganic dielectric in an organic polymer and exhibiting a high dielectric constant in the case where the composition is used for producing an organic-inorganic composite dielectric.The present invention is directed to a liquid composition for a composite dielectric, which comprises an inorganic dielectric and a fluorinated aromatic polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.