Carboxylic acid-modified bisphenol epoxy di(meth)acrylate
US7632912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2009 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Apr 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.