Semiconductor device and a method of manufacturing the same
US7633146B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2008 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | May 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Detachably mountable memory card featuring a memory chip(s) and a control chip includes a substrate of an insulating material, conductive layers provided on a first main surface of the substrate, a plurality of external electrode terminals exposed to the opposing, second main surface of the substrate, and conductive portions electrically connecting the conductive layers with corresponding ones of the external electrode terminals. The memory chip(s) and the control chip are electrically connected with ones of the conductive layers. The memory card also includes an encapsulating insulating layer covering the first main surface of the substrate, the fixedly disposed memory and control chips thereon, and the conductive layers, the encapsulating insulating layer having an exposed flat surface representing one main plane surface of the finished memory card, and the second main surface of the substrate representing another main plane surface of the memory card with the exposed external electrode terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.