Method for manufacturing electronic device panel and structure thereof
US7634081B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2007 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Aug 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2229/047
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a panel having a surface of three-dimensional patterns and the structure thereof, first of all, provides a piece body, on the surface of which plane panel patterns are arranged by means of ink printing process, and which is thermally pressed into a plurality of projected three-dimensional panels. The piece body having projected three-dimensional panels is then placed between a lower mould and a first upper mould. A material of hard resin is injected into the clearance between the lower mould and the three-dimensional panel surfaces, and thus a transparent cladding layer capable of wear-resistance and protection for three-dimensional panels is formed. Next, material of hard resin is again injected into the space between the inner wall surfaces of the three-dimensional panels and a second upper mould for forming a supporting layer for supporting the three-dimensional panels. Afterwards, a material of rubber is injected into the space between a third upper mould and the inner wall surfaces of three-dimensional panels to form an elastic layer. At last, castings on the piece body and three molded layers are integrally cut according to respective contour to thu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.