Three terminal magnetic sensing devices having base lead layers in-plane with collector substrate materials and methods of making the same
US7635599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2005 |
| Grant date | Dec 22, 2009 |
| Priority date | — |
| Expiry date | Feb 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/385
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Three terminal magnetic sensing devices (TTMs) having base lead layers in-plane with collector substrate materials, and methods of making the same, are disclosed. In one illustrative example, a collector substrate having an elevated region and a recessed region adjacent the elevated region is provided. An insulator layer is formed in full-film over the collector substrate, and a base lead layer is formed in full-film over the insulator layer and in-plane with semiconductor materials of the elevated region. The insulator materials and the base lead materials that are formed over the elevated region are removed. A sensor stack structure having an emitter region and a base region is then formed over the elevated region such that part of the base region is formed over an end of the base lead layer. A base conductive via may be formed to contact base lead materials of the base lead layer at a suitable distance away from the sensor stack structure. Advantageously, the base conductive via formation may occur without causing damage to the sensor stack structure. Also, the base lead layer is formed in the recessed region of the collector substrate prior to the formation of the sensor stack …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.