Heat seal modifiers for linear polyethylenes
US7635736B2 · kind B2 · utility
3Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Dec 22, 2009 |
| Priority date | — |
| Expiry date | May 28, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/0876
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is linear polyethylene composition suitable for use as a heat seal resin, wherein the resin comprises: (a) from about 70 wt % to about 90 wt % of a linear polyethylene having a density of from about 0.88 to about 0.92 g/cm3; (b) from about 0 wt % to about 30 wt % of a copolymer of ethylene and an α,β-unsaturated carboxylic acid and/or an ionomer thereof; and, (c) from about 2 wt % to about 10 wt % of a tackifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.