Moisture-curing composition and hot-melt adhesive

US7635743B2 · kind B2 · utility

Assignee

• Bayer MaterialScience AG · DE

Inventors

• Matthias Wintermantel · Bensberg, DE
• Walter Meckel · Neuss, DE
• Michael Ludewig

Key dates

• Filing date: Dec 13, 2005
• Grant date: Dec 22, 2009
• Expiry date: Mar 17, 2026

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G2170/20
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a composition based on alkoxysilane-functional polyurethane prepolymers suitable for a reactive hot-melt adhesive which is stable to storage at a high temperature but cures very rapidly under the action of moisture from the atmosphere or from the materials glued to one another and which is suitable for joining the most diverse materials. The invention also relates to the process for gluing the most diverse substrates using the reactive hot-melt adhesive according to the invention.