Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip

US7635869B2 · kind B2 · utility

Assignee

• LUMINATION LLC · US

Inventors

• Boris Kolodin · Beachwood, US
• Michael Hsing · Saratoga, US
• Stanton Earl Weaver · Broadalbin, US
• Ivan Eliashevich · Maplewood, US
• Srinath K. Aanegola · Parma Heights, US

Key dates

• Filing date: Sep 14, 2006
• Grant date: Dec 22, 2009
• Expiry date: Jan 6, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10253

Abstract

In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.