Computer enclosure
US7636244B2 · kind B2 · utility
42Cited by
26References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Dec 22, 2009 |
| Priority date | — |
| Expiry date | Jan 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.