Patent · US Expired

Laminated multi-layer card with an inlaid security element in the form of relief structures

US7637537B2 · kind B2 · utility

5Cited by

17References

20Claims

0Family size

Assignee

GIESECKE & DEVRIENT GMBH · DE

Inventors

Mario Keller · Bad Endorf, DE
Günter Endres · Birkenfeld, DE
Manfred Engl · Birkenfeld, DE

Key dates

Filing date	Feb 20, 2001
Grant date	Dec 29, 2009
Priority date	—
Expiry date	Mar 18, 2023

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB42D25/455
WIPO fieldOther consumer goods
WIPO sectorOther fields

Abstract

A card, in particular credit card, identity card, bank card or the like is proposed that includes a plurality of laminated layers between which a security element with a relief structure, in particular holographic diffraction structures, is embedded. The materials are selected so that the softening temperature of the security element layer having the relief structure has a higher softening temperature than the card layers between which the security element is laminated. This permits the multilayer laminated card to be produced by conventional laminating methods without appreciably impairing the relief structure by the pressures and temperatures thereby occurring. Special combinations of materials and in particular suitable materials for the layer having the relief structure are proposed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.