Lapping plate resurfacing abrasive member and method
US7637802B2 · kind B2 · utility
5Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2006 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Sep 7, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loose abrasive grains are fed onto the plate. A synthetic resin-based elastic abrasive member having a Rockwell hardness (HRS) in the range of −30 to −100 is effective for resurfacing the lapping plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.