Probe tip plating
US7638028B2 · kind B2 · utility
16Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2005 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.