Real time target topography tracking during laser processing
US7638731B2 · kind B2 · utility
10Cited by
10References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Dec 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An efficient method of and a system for performing topography measurement facilitates increasing laser machining throughput. Topography measurements at multiple points on a target specimen or continuous real time measurement and monitoring of the target specimen surface topography and target specimen thickness can be performed during a laser machining process. Measurement of the thickness of the target specimen to be laser machined would permit fine tuning of laser energy delivered and result in higher quality target material removal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.