Laminated wafer sensor system for UV dose measurement
US7638798B2 · kind B2 · utility
0Cited by
18References
19Claims
0Family size
Assignee
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Key dates
| Filing date | May 10, 2007 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Aug 15, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F99/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A laminated wafer sensor structure includes a housing layer having pocket openings formed therein, a circuit layer having a sensor element and electronic components mounted for registration with the pocket openings in the housing layer, and a rigid back layer. The laminated structure is suitable for handling by conventional robotic wafer handling systems. The wafer sensor structure is adapted for electrical connection to a base station that is also adapted for connection to a host computer system to facilitate communication among the sensor structure, the base station and the host computer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.