Patent · US Active

Semiconductor device

US7638869B2 · kind B2 · utility

69Cited by

2References

10Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Roland Irsigler · Munich, DE
Steve Wood · Munich, DE
Hermann Ruckerbauer · Radolfzell, DE
Richard Luyken · Munich, DE
Carsten Niepelt · Dietramszell, DE

Key dates

Filing date	Mar 28, 2007
Grant date	Dec 29, 2009
Priority date	—
Expiry date	Sep 17, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1433
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.