Method for forming radio frequency antenna
US7639184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2005 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Apr 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.