Heat dissipation device having a fan mounted thereon
US7639497B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Dec 10, 2007 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Jan 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip comprises a V-shaped main body and two locking parts at two opposite ends of the main body. Middles of the main bodies of the two wire clips are securely attached to two lateral sides of the heat sink by two screws. The locking parts of the wire clips are fastened to the frame of the fan, with the main bodies being deformed and pushing the fan toward the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.