Method for simulating a hydroforming process
US7640144B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 26, 2006 |
| Grant date | Dec 29, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/14
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for simulating a hydroforming process includes modeling a virtual hydroforming die and a virtual tubular workpiece. The virtual workpiece is placed within the die after the die has been expanded. The die is then contracted to a finished size while the workpiece is deformed into a non-circular cross section in contact with the virtual die. The workpiece is subsequently pressurized to simulate production of a finished part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.