Method for thermal seaming of polyimides
US7641758B2 · kind B2 · utility
2Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2007 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is a method for seaming a polyimide material. The method involves forming an interface between multiple the polyimide materials. Next, heat is applied to the interface to soften the polyimide material. The temperature of the heat source is below the melting point of the polyimide material. Finally, pressure is applied to the interface to create a seam between the polyimide materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.