Decoupling capacitor closely coupled with integrated circuit
US7642131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2006 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Nov 23, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.