MEMS packaging with improved reaction to temperature changes
US7642628B2 · kind B2 · utility
2Cited by
46References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2005 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Oct 22, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/047
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.