Heat dissipating apparatus with heat pipe
US7643294B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 19, 2007 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Feb 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus includes a heat spreader (20) for thermally connecting with a heat generating electronic component, a heat sink (10) thermally connected with the heat spreader, and a heat pipe (30) thermally connecting the heat sink with the heat spreader for transferring heat from the heat spreader to the heat sink. The heat pipe includes an evaporation section (31) attached to the heat spreader, two semicircular condensation sections (33, 34) thermally engaging with the heat sink, and two connecting sections (35, 36) each interconnecting a corresponding condensation section and the evaporation section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.