On chip temperature measuring and monitoring method
US7645071B2 · kind B2 · utility
2Cited by
44References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2008 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Apr 12, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/015
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device temperature measurement circuit, an integrated circuit (IC) including a device temperature measurement circuit, a method of characterizing device temperature and a method of monitoring temperature. The circuit includes a constant current source and a clamping device. The clamping device selectively shunts current from the constant current source or allows the current to flow through a PN junction, which may be the body to source/drain junction of a field effect transistor (FET). Voltage measurements are taken directly from the PN junction. Junction temperature is determined from measured junction voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.