Method and apparatus for treating a substrate
US7645495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/513
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.