Patent · US Active

Copper bonding or superfine wire with improved bonding and corrosion properties

US7645522B2 · kind B2 · utility

9Cited by

2References

14Claims

0Family size

Assignee

W. C. Heraeus GmbH · DE

Inventors

Albrecht Bischoff · Bruchköbel, DE
Heinz Forderer · Barby, DE
Lutz Schrapler · Alzenau, DE
Frank Krüger · Könnern, DE

Key dates

Filing date	Sep 7, 2007
Grant date	Jan 12, 2010
Priority date	—
Expiry date	Sep 7, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2938
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.