Methods for assembling thin semiconductor die
US7645637B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2006 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Nov 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term “self-filleting” refers to any adhesive that when dispensed and then subjected to suitable cure conditions, will flow and fill up the area between two die or between a die and a substrate while not forming a bulky fillet that can overflow onto the top of the die. In addition, the invention is useful for tight tolerance semiconductor die assemblies, since the fillet from the die-attach adhesives employed in the methods of the invention does not cover bond fingers, thereby causing wire bond yield loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.