Reactive hot melt adhesives
US7645831B2 · kind B2 · utility
2Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2004 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Jun 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Reactive hot melt adhesives compositions with long open time and/or high green strength are prepared by the use of urethane diols. These results are achievable at moderate/low application viscosity or low application temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.