High density ethylene homopolymers and blend compositions
US7645835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2006 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Aug 10, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2314/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibers, and cable and wire coatings and jacketings and, various forms of pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.