LED package methods and systems
US7646029B2 · kind B2 · utility
169Cited by
36References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2005 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Dec 25, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.