Semiconductor device and manufacturing method thereof
US7646092B2 · kind B2 · utility
2Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2006 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Aug 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.