Diamond enhanced thickness shear mode resonator
US7646138B2 · kind B2 · utility
42Cited by
6References
24Claims
0Family size
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Key dates
| Filing date | Nov 21, 2007 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Nov 21, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/279
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thickness shear mode (TSM) resonator is described, comprising a diamond layer. The diamond layer is preferably a high quality diamond layer with at least 90% sp3 bonding or diamond bonding. A method for manufacturing such a resonator is also described. The thickness shear mode resonator according to embodiments described herein may advantageously be used in biosensor application and in electrochemistry applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.