Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects
US7646567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Nov 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49027
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.