Heat transfer plate
US7646608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2005 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Feb 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for coupling a heat-generating device to a heat-removing device. The apparatus includes a thermally-conductive plate having a first side and a second side. The apparatus also includes a plurality of first channels that intersect with a plurality of second channels formed on at least one of the first side and the second side. The formation of the first channels and the second channels weaken the thermally-conductive plate. The apparatus further includes a plurality of protrusions formed by the intersection of the first channels and the second channels. The protrusions are deformable by coupling the thermally-conductive plate between the heat-generating device and the heat-removing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.