Modular solid-state laser platform based on coaxial package and corresponding assembly process
US7648290B2 · kind B2 · utility
5Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Sep 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/1643
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Application of a modular coaxial package design, compatible with telecommunication passive component packaging, to microchip lasers, in particular to passively Q-switched microlasers, pumped with a fiber-coupled diode, is disclosed. The number of parts is thereby reduced while providing the adequate degrees of freedom for the active or passive alignment of the optical elements within the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.