Method of forming flexible electronic circuits
US7648821B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Oct 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multiple layer photosensitive element having at least three differently sensitised photosensitive layers on one side of a support, such as a, transparent flexible support, is imagewise exposed according to a desired circuit pattern and developed to form two layers of conductive track patterns from each photosensitive layer, which may then be connected together by forming vias by drilling or in situ generation. The resulting multiple layer conductive element has application in the field of printed circuit board manufacture or as the backplane electronic element of a flexible display device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.