Modular bonding pad structure and method
US7648903B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Aug 17, 2007 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Aug 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.