Method and apparatus for processing a conductive thin film
US7648906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Mar 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.