Addition-curable organopolysiloxane resin composition
US7649059B2 · kind B2 · utility
9Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2004 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Feb 11, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole % is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole % is phenyl; and an addition reaction-curing catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.