Connection structure between wired circuit boards
US7649144B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2008 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Aug 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The connection structure between wired circuit boards connects a first wired circuit board and a second wired circuit board. The first wired circuit board includes a metal supporting layer, a first insulating layer formed on the metal supporting layer, and a first conductive pattern formed on the first insulating layer and having a first terminal portion. The metal supporting layer is arranged so as not to be opposed to the first terminal portion in a thickness direction. The first terminal portion and the first insulating layer opposed to the first terminal portion in a thickness direction are folded back into a curved shape. The second wired circuit board includes a second insulating layer, and a second conductive pattern formed on the second insulating layer and having a second terminal portion. The first terminal portion and the second terminal portion are electrically connected to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.